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[ subject:"Solder and soldering." ]
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Modern solder technology for competi...
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Hwang, Jennie S.
Modern solder technology for competitive electronics manufacturing /
紀錄類型:
書目-語言資料,印刷品 : Monograph/item
正題名/作者:
Modern solder technology for competitive electronics manufacturing /Jennie S. Hwang.
作者:
Hwang, Jennie S.
出版者:
New York :McGraw-Hill,c1996.
面頁冊數:
xliv, 622 p. :ill. ;24 cm.
叢書名:
Electronic packaging and interconnection series
標題:
Electronic packaging.
ISBN:
0070317496 :
Modern solder technology for competitive electronics manufacturing /
Hwang, Jennie S.
Modern solder technology for competitive electronics manufacturing /
Jennie S. Hwang. - New York :McGraw-Hill,c1996. - xliv, 622 p. :ill. ;24 cm. - Electronic packaging and interconnection series.
Includes bibliographical references and index.
ISBN: 0070317496 :NT$2,209
LCCN: 95044641 Subjects--Topical Terms:
182161
Electronic packaging.
LC Class. No.: TK7870.15 / H991 1996
Dewey Class. No.: 621.381/046
Modern solder technology for competitive electronics manufacturing /
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