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Electrical design of through silicon via

~

Kim, Joungho.

Electrical design of through silicon via

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Electrical design of through silicon viaedited by Manho Lee, Jun So Pak, Joungho Kim.
其他作者:	Lee, Manho.
出版者:	Dordrecht :Springer Netherlands :2014.
面頁冊數:	ix, 280 p. :ill., digital ;24 cm.
Contained By:	Springer eBooks
標題:	Three-dimensional integrated circuitsDesign and construction.
電子資源:	http://dx.doi.org/10.1007/978-94-017-9038-3
ISBN:	9789401790383 (electronic bk.)

Electrical design of through silicon via
Electrical design of through silicon via[electronic resource] /edited by Manho Lee, Jun So Pak, Joungho Kim. - Dordrecht :Springer Netherlands :2014. - ix, 280 p. :ill., digital ;24 cm.

ISBN: 9789401790383 (electronic bk.)Subjects--Topical Terms:

677061
Three-dimensional integrated circuits
--Design and construction.

Dewey Class. No.: 621.3815

Electrical design of through silicon via
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http://dx.doi.org/10.1007/978-94-017-9038-3

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