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Search result for
[ subject:"Electronic packaging"]
21 records (0.032s)
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Page 1 of 3
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1
.
The electronic packaging handbook /
~
Blackwell, Glenn R.
The electronic packaging handbook /
by:
Blackwell, Glenn R.
Language materials, printed
: Monograph/item
Language:
英文
Publisher:
CRC Press :; IEEE Press,
Place of Publication:
Boca Raton, FL :
Year of Publication:
2000
ISBN:
0849385911
Availability
:
1 Copie(s) available
|
1 Copie(s) available for loan
based on 0 review(s)
2
.
Electronic packaging materials and t...
~
Pecht, Michael.
Electronic packaging materials and their properties /
by:
Pecht, Michael.
Language materials, printed
: Monograph/item
Language:
英文
Publisher:
CRC Press,
Place of Publication:
Boca Raton :
Year of Publication:
1999
ISBN:
0849396255
Availability
:
1 Copie(s) available
|
1 Copie(s) available for loan
based on 0 review(s)
3
.
Electronic packaging and interconnec...
~
Harper, Charles A.
Electronic packaging and interconnection handbook /
by:
Harper, Charles A.
Language materials, printed
: Monograph/item
Publisher:
McGraw-Hill,
Place of Publication:
New York :
Year of Publication:
2000
ISBN:
0071347453
Availability
:
1 Copie(s) available
|
1 Copie(s) available for loan
based on 0 review(s)
4
.
Electronic packaging and interconnec...
~
Harper, Charles A.
Electronic packaging and interconnection handbook /
by:
Harper, Charles A.
Language materials, printed
: Monograph/item
Language:
英文
Publisher:
McGraw-Hill,
Place of Publication:
New York :
Year of Publication:
1997
ISBN:
00702669483032
Availability
:
1 Copie(s) available
|
1 Copie(s) available for loan
based on 0 review(s)
5
.
Handbook of electronic package design /
~
Pecht, Michael.
Handbook of electronic package design /
by:
Pecht, Michael.
Language materials, printed
: Monograph/item
Publisher:
Marcel Dekker,
Place of Publication:
New York :
Year of Publication:
1991
ISBN:
0824779215
Availability
:
1 Copie(s) available
|
1 Copie(s) available for loan
based on 0 review(s)
6
.
Electronic packaging and interconnec...
~
Harper, Charles A.
Electronic packaging and interconnection handbook /
by:
Harper, Charles A.
Language materials, printed
: Monograph/item
Publisher:
McGraw-Hill,
Place of Publication:
New York :
Year of Publication:
2005
ISBN:
0071430482
Availability
:
1 Copie(s) available
|
1 Copie(s) available for loan
based on 0 review(s)
7
.
Wire bonding in microelectronics :ma...
~
Harman, George G.
Wire bonding in microelectronics :materials, processes, reliability, and yield /
by:
Harman, George G.
Language materials, printed
: Monograph/item
Publisher:
McGraw-Hill,
Place of Publication:
New York :
Year of Publication:
1997
ISBN:
0070326193
Availability
:
1 Copie(s) available
|
1 Copie(s) available for loan
based on 0 review(s)
8
.
Wire bonding in microelectronics
by:
Harman, George G.
Electronic resources
: Monograph/item
Language:
英文
Publisher:
McGraw-Hill,
Place of Publication:
New York :
Year of Publication:
2010
ISBN:
9780071476232; 9780071642651
Availability
:
1 Copie(s) available
|
1 Copie(s) available for loan
based on 0 review(s)
9
.
Advanced wirebond interconnection te...
~
Prasad, Shankara K.
Advanced wirebond interconnection technology
by:
Prasad, Shankara K.; SpringerLink (Online service)
Electronic resources
: Monograph/item
Publisher:
Kluwer Academic Publishers,
Place of Publication:
Boston :
Year of Publication:
2004
ISBN:
9781402077623; 9781402077630
Availability
:
1 Copie(s) available
|
1 Copie(s) available for loan
based on 0 review(s)
10
.
Failure modes and mechanisms in elec...
~
Singh, Pratap, (1940-)
Failure modes and mechanisms in electronic packages /
by:
Singh, Pratap, (1940-); Viswanadham, Puligandla.
Language materials, printed
: Monograph/item
Publisher:
Chapman & Hall,
Place of Publication:
New York :
Year of Publication:
1998
ISBN:
0412105918
Availability
:
1 Copie(s) available
|
1 Copie(s) available for loan
based on 0 review(s)
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