國立高雄大學圖資館 |

Search result for [ subject:"Electronic packaging."]

22 records (0.025s)· Page 1 of 3 • 1 2 3

1.

Manufacturing challenges in electron...

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Chen, William T.
- Manufacturing challenges in electronic packaging /
- by: Chen, William T.; Lee, Yung-Cheng.
- Language materials, printed : Monograph/item
- Publisher: Chapman & Hall,
- Place of Publication: New York :
- Year of Publication: 1998
- ISBN: 0412620308
- Availability: 1 Copie(s) available | 1 Copie(s) available for loan
- based on 0 review(s)
2.

Electronic packaging of high speed a...

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Helland, Arden R.
- Electronic packaging of high speed and microwave circuitry /
- by: Helland, Arden R.; Konsowski, Stephen G.
- Language materials, printed : Monograph/item
- Publisher: McGraw-Hill,
- Place of Publication: New York :
- Year of Publication: 1997
- ISBN: 0070359709
- Availability: 1 Copie(s) available | 1 Copie(s) available for loan
- based on 0 review(s)
3.

Circuits, interconnections, and pack...

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Bakoglu, H. B., (1958-)
- Circuits, interconnections, and packaging for VLSI /
- by: Bakoglu, H. B., (1958-)
- Language materials, printed : Monograph/item
- Publisher: Addison-Wesley Pub. Co.,
- Place of Publication: Reading, Mass. :
- Year of Publication: 1990
- ISBN: 0201060086
- Availability: 1 Copie(s) available | 1 Copie(s) available for loan
- based on 0 review(s)
4.

Encyclopedia of thermal packaging.Se...

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Bar-Cohen, Avram, (1946-)
- Encyclopedia of thermal packaging.Set 1,Thermal packaging techniques
- by: Bar-Cohen, Avram, (1946-)
- Electronic resources : Monograph/item
- Publisher: World Scientific,
- Place of Publication: Singapore :
- Year of Publication: 2013
- ISBN: 9789814313797; 9789814452595; 9814313793
- Availability: 1 Copie(s) available | 1 Copie(s) available for loan
- based on 0 review(s)
5.

Modern solder technology for competi...

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Hwang, Jennie S.
- Modern solder technology for competitive electronics manufacturing /
- by: Hwang, Jennie S.
- Language materials, printed : Monograph/item
- Publisher: McGraw-Hill,
- Place of Publication: New York :
- Year of Publication: 1996
- ISBN: 0070317496
- Availability: 1 Copie(s) available | 1 Copie(s) available for loan
- based on 0 review(s)
6.
- Lead-free soldering in electronicsscience, technology and environmental impact /
- by: MyiLibrary.; Suganuma, Katsuaki.
- Electronic resources : Monograph/item
- Publisher: Marcel Dekker,
- Place of Publication: New York ;
- Year of Publication: 2004
- ISBN: 9786610102853
- Availability: 1 Copie(s) available | 1 Copie(s) available for loan
- based on 0 review(s)
7.

Surface mount technology for concurr...

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Classon, Frank.
- Surface mount technology for concurrent engineering and manufacturing /
- by: Classon, Frank.
- Language materials, printed : Monograph/item
- Publisher: McGraw-Hill,
- Place of Publication: New York :
- Year of Publication: 1993
- ISBN: 0070112002
- Availability: 1 Copie(s) available | 1 Copie(s) available for loan
- based on 0 review(s)
8.

Thin film technology handbook /

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Barlow, Fred D.
- Thin film technology handbook /
- by: Barlow, Fred D.; Elshabini-Riad, Aicha A. R.
- Language materials, printed : Monograph/item
- Publisher: McGraw-Hill,
- Place of Publication: New York :
- Year of Publication: 1998
- ISBN: 0070190259
- Availability: 1 Copie(s) available | 1 Copie(s) available for loan
- based on 0 review(s)
9.

Packaging of high power semiconducto...

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Liu, Xingsheng.
- Packaging of high power semiconductor lasers
- by: Liu, Xingsheng.; SpringerLink (Online service)
- Electronic resources : Monograph/item
- Language: 英文
- Publisher: Imprint: Springer,; Springer New York :
- Place of Publication: New York, NY :
- Year of Publication: 2015
- ISBN: 9781461492627; 9781461492634
- Availability: 1 Copie(s) available | 1 Copie(s) available for loan
- based on 0 review(s)
10.
- Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging /
- by: Wei, Xing-Chang,
- Language materials, printed : Monograph/item
- Publisher: CRC Press, Taylor & Francis Group,
- Place of Publication: Boca Raton :
- Year of Publication: 2017
- ISBN: 9780367573669; 9781138033566
- Availability: 1 Copie(s) available | 1 Copie(s) available for loan
- based on 0 review(s)

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