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Search result for
[ subject:"Multichip modules (Microelectronics)"]
12 records (0.03s)
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Page 1 of 2
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2
1
.
Multi-chip module test strategies /
~
Zorian, Yervant.
Multi-chip module test strategies /
by:
Zorian, Yervant.
Language materials, printed
: Monograph/item
Publisher:
Kluwer,
Place of Publication:
Boston :
Year of Publication:
1997
ISBN:
079239920X
Availability
:
1 Copie(s) available
|
1 Copie(s) available for loan
based on 0 review(s)
2
.
Low cost flip chip technologies :for...
~
Lau, John H.
Low cost flip chip technologies :for DCA, WLCSP, and PBGA assemblies /
by:
Lau, John H.
Language materials, printed
: Monograph/item
Publisher:
McGraw-Hill,
Place of Publication:
New York :
Year of Publication:
2000
ISBN:
0071351418
Availability
:
1 Copie(s) available
|
1 Copie(s) available for loan
based on 0 review(s)
3
.
Advanced electronic packaging :with ...
~
Brown, William D., (1943-)
Advanced electronic packaging :with emphasis on multichip modules /
by:
Brown, William D., (1943-)
Language materials, printed
: Monograph/item
Publisher:
IEEE Press,
Place of Publication:
New York :
Year of Publication:
1999
ISBN:
0780347005
Availability
:
1 Copie(s) available
|
1 Copie(s) available for loan
based on 0 review(s)
4
.
Introduction to system-on-package (S...
~
Swaminathan, Madhavan.
Introduction to system-on-package (SOP) :miniaturization of the entire system /
by:
Swaminathan, Madhavan.; Tummala, Rao R., (1942-)
Language materials, printed
: Monograph/item
Publisher:
McGraw-Hill,
Place of Publication:
New York :
Year of Publication:
2008
ISBN:
0071459065; 9780071459068
Availability
:
1 Copie(s) available
|
1 Copie(s) available for loan
based on 0 review(s)
5
.
Introduction to system-on-package (S...
~
Swaminathan, Madhavan.
Introduction to system-on-package (SOP) :miniaturization of the entire system /
by:
Swaminathan, Madhavan.; Tummala, Rao R., (1942-)
Language materials, printed
: Monograph/item
Language:
英文
Publisher:
McGraw-Hill,
Place of Publication:
New York :
Year of Publication:
2008
ISBN:
0071459065; 9780071459068
Availability
:
1 Copie(s) available
|
1 Copie(s) available for loan
based on 0 review(s)
6
.
SiP system-in-package design and sim...
~
Li, Suny, (1974-)
SiP system-in-package design and simulationmentor EE flow advanced design guide /
by:
Li, Suny, (1974-)
Electronic resources
: Monograph/item
Publisher:
John Wiley & Sons Singapore,
Place of Publication:
Singapore ;
Year of Publication:
2017
ISBN:
1119045991; 1119046009; 1119046017; 9781119045991; 9781119046004; 9781119046011
Availability
:
1 Copie(s) available
|
1 Copie(s) available for loan
based on 0 review(s)
7
.
Multichip module technology handbook /
~
Garrou, Philip E.
Multichip module technology handbook /
by:
Garrou, Philip E.; Turlik, Iwona.
Language materials, printed
: Monograph/item
Publisher:
McGraw-Hill,
Place of Publication:
New York :
Year of Publication:
1998
ISBN:
0070228949
Availability
:
1 Copie(s) available
|
1 Copie(s) available for loan
based on 0 review(s)
8
.
Multichip modules with integrated se...
~
Harsanyi, Gabor.
Multichip modules with integrated sensors /
by:
Harsanyi, Gabor.; Jones, W. Kinzy.
Language materials, printed
: Monograph/item
Publisher:
Kluwer Academic Publishers,
Place of Publication:
Dordrecht ;
Year of Publication:
1996
ISBN:
0792341945
Availability
:
1 Copie(s) available
|
1 Copie(s) available for loan
based on 0 review(s)
9
.
System-in-package RF design and appl...
~
Gaynor, Michael P.
System-in-package RF design and applications /
by:
Gaynor, Michael P.
Language materials, printed
: Monograph/item
Language:
英文
Publisher:
Artech House,
Place of Publication:
Boston :
Year of Publication:
2007
ISBN:
158053905X; 9781580539050
Availability
:
1 Copie(s) available
|
1 Copie(s) available for loan
based on 0 review(s)
10
.
MCM C/mixed technologies and thick f...
~
(1998 :)
MCM C/mixed technologies and thick film sensors /
by:
(1998 :); Jones, W. Kinzy.
Language materials, printed
: Monograph/item
Publisher:
Kluwer Academic Publishers,
Place of Publication:
Dordrecht ;
Year of Publication:
1995
ISBN:
0792334604
Availability
:
1 Copie(s) available
|
1 Copie(s) available for loan
based on 0 review(s)
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