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Search result for [ subject:"Three-dimensional integrated circuits"]

6 records (0.03s)· Page 1 of 1 • 1

1.

Three-dimensional integrated circuit...

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Friedman, Eby G.,
- Three-dimensional integrated circuit design /
- by: Friedman, Eby G.,; Pavlidis, Vasilis F., (1976-); Savidis, Ioannis,
- Language materials, printed : Monograph/item
- Publisher: Morgan Kaufmann Publishers,
- Place of Publication: Cambridge, MA :
- Year of Publication: 2017
- ISBN: 0124105017; 9780124105010
- Availability: 1 Copie(s) available | 1 Copie(s) available for loan
- based on 0 review(s)
2.
- Physical design for 3D integrated circuits /
- by: Tan, Chuan Seng,; Todri-Sanial, Aida,
- Language materials, printed : Monograph/item
- Publisher: CRC Press,
- Place of Publication: Boca Raton :
- Year of Publication: 2016
- ISBN: 9780367778873; 9781498710367
- Availability: 1 Copie(s) available | 1 Copie(s) available for loan
- based on 0 review(s)
3.

Handbook of 3D Integration3D process...

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Garrou, Philip E.
- Handbook of 3D Integration3D process technology /
- by: Garrou, Philip E.; Koyanagi, Mitsumasa.; Ramm, Peter.
- Electronic resources : Monograph/item
- Publisher: Wiley-VCH,
- Place of Publication: Weinheim, Germany :
- Year of Publication: 2014
- ISBN: 3527670106; 9783527670109
- Availability: 1 Copie(s) available | 1 Copie(s) available for loan
- based on 0 review(s)
4.

Design-for-test and test optimizatio...

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Chakrabarty, Krishnendu.
- Design-for-test and test optimization techniques for TSV-based 3D stacked ICs
- by: Chakrabarty, Krishnendu.; Noia, Brandon.; SpringerLink (Online service)
- Electronic resources : Monograph/item
- Language: 英文
- Publisher: Imprint: Springer,; Springer International Publishing :
- Place of Publication: Cham :
- Year of Publication: 2014
- ISBN: 9783319023779; 9783319023786
- Availability: 1 Copie(s) available | 1 Copie(s) available for loan
- based on 0 review(s)
5.

Arbitrary modeling of TSVs for 3D in...

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El-Rouby, Alaa.
- Arbitrary modeling of TSVs for 3D integrated circuits
- by: El-Rouby, Alaa.; Ismail, Yehea.; Salah, Khaled.; SpringerLink (Online service)
- Electronic resources : Monograph/item
- Language: 英文
- Publisher: Imprint: Springer,; Springer International Publishing :
- Place of Publication: Cham :
- Year of Publication: 2015
- ISBN: 9783319076102; 9783319076119
- Availability: 1 Copie(s) available | 1 Copie(s) available for loan
- based on 0 review(s)
6.

Electrical design of through silicon via

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Kim, Joungho.
- Electrical design of through silicon via
- by: Kim, Joungho.; Lee, Manho.; Pak, Jun So.; SpringerLink (Online service)
- Electronic resources : Monograph/item
- Language: 英文
- Publisher: Imprint: Springer,; Springer Netherlands :
- Place of Publication: Dordrecht :
- Year of Publication: 2014
- ISBN: 9789401790376; 9789401790383
- Availability: 1 Copie(s) available | 1 Copie(s) available for loan
- based on 0 review(s)

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