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Search result for [ subject:"Three-dimensional integrated circuits."]

6 records (0.023s)· Page 1 of 1 • 1

1.

Power, thermal, noise, and signal in...

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Gontrand, Christian,
- Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement /
- by: Gontrand, Christian,; Ma, Yue ((Electronics engineer),)
- Language materials, printed : Monograph/item
- Year of Publication: 2018
- ISBN: 0367023431; 9780367023430
- Availability: 1 Copie(s) available | 1 Copie(s) available for loan
- based on 0 review(s)
2.

Advances in 3D integrated circuits a...

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Tan, Chuan Seng.
- Advances in 3D integrated circuits and systems
- by: Tan, Chuan Seng.; Yu, Hao.
- Electronic resources : Monograph/item
- Publisher: World Scientific,
- Place of Publication: New Jersey :
- Year of Publication: 2016
- ISBN: 9789814699020
- Availability: 1 Copie(s) available | 1 Copie(s) available for loan
- based on 0 review(s)
3.

Design and modeling for 3D ICs and i...

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Han, Ki Jin.
- Design and modeling for 3D ICs and interposers
- by: Han, Ki Jin.; Swaminathan, Madhavan.
- Electronic resources : Monograph/item
- Publisher: World Scientific
- Place of Publication: Hackensack, NJ :
- Year of Publication: 2014
- ISBN: 9789814508605; 9814508608
- Availability: 1 Copie(s) available | 1 Copie(s) available for loan
- based on 0 review(s)
4.

3D integration in VLSI circuitsimple...

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Iniewski, Krzysztof.
- 3D integration in VLSI circuitsimplementation technologies and applications /
- by: Iniewski, Krzysztof.; Sakuma, Katsuyuki.
- Electronic resources : Monograph/item
- Publisher: CRC Press,
- Place of Publication: Boca Raton, FL :
- Year of Publication: 2018
- ISBN: 9781315200699; 9781351779814
- Availability: 1 Copie(s) available | 1 Copie(s) available for loan
- based on 0 review(s)
5.

Vertical 3D memory technologies

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Prince, Betty.
- Vertical 3D memory technologies
- by: Prince, Betty.
- Electronic resources : Monograph/item
- Publisher: Wiley,
- Place of Publication: Chichester, West Sussex, United Kingdom :
- Year of Publication: 2014
- ISBN: 111876045X; 1118760468; 1118760476; 1322007799; 9781118760451; 9781118760468; 9781118760475; 9781322007793
- Availability: 1 Copie(s) available | 1 Copie(s) available for loan
- based on 0 review(s)
6.

3D stacked chipsfrom emerging proces...

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Elfadel, Ibrahim M.
- 3D stacked chipsfrom emerging processes to heterogeneous systems /
- by: Elfadel, Ibrahim M.; Fettweis, Gerhard.; SpringerLink (Online service)
- Electronic resources : Monograph/item
- Language: 英文
- Publisher: Imprint: Springer,; Springer International Publishing :
- Place of Publication: Cham :
- Year of Publication: 2016
- ISBN: 9783319204802; 9783319204819
- Availability: 1 Copie(s) available | 1 Copie(s) available for loan
- based on 0 review(s)

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