語系:
繁體中文
English
說明(常見問題)
圖資館首頁
登入
Electronic packaging and interconnection series.
Titles
Multichip module technology handbook /
~
Garrou, Philip E.
Multichip module technology handbook /
by:
Garrou, Philip E.
Surface mount technology for concurr...
~
Classon, Frank.
Surface mount technology for concurrent engineering and manufacturing /
by:
Classon, Frank.
Modern solder technology for competi...
~
Hwang, Jennie S.
Modern solder technology for competitive electronics manufacturing /
by:
Hwang, Jennie S.
Wire bonding in microelectronics :ma...
~
Harman, George G.
Wire bonding in microelectronics :materials, processes, reliability, and yield /
by:
Harman, George G.
Thermal management handbook :for ele...
~
Krum, Al.
Thermal management handbook :for electronic assemblies /
by:
Krum, Al.
Electronic packaging of high speed a...
~
Helland, Arden R.
Electronic packaging of high speed and microwave circuitry /
by:
Helland, Arden R.
Thin film technology handbook /
~
Barlow, Fred D.
Thin film technology handbook /
by:
Barlow, Fred D.
Electronic packaging and interconnec...
~
Harper, Charles A.
Electronic packaging and interconnection handbook /
by:
Harper, Charles A.
Electronic connector handbook :theor...
~
Mroczkowski, Robert S.
Electronic connector handbook :theory and applications /
by:
Mroczkowski, Robert S.
Electronic systems quality managemen...
~
Ludwig-Becker, Marsha.
Electronic systems quality management handbook /
by:
Ludwig-Becker, Marsha.
Ball grid array technology /
~
Lau, John H.
Ball grid array technology /
by:
Lau, John H.
Electronic materials and processes h...
~
Harper, Charles A.
Electronic materials and processes handbook /
by:
Harper, Charles A.
Electronic assembly fabrication :chi...
~
Harper, Charles A.
Electronic assembly fabrication :chips, circuit boards, packages, and components /
by:
Harper, Charles A.
處理中
...
變更密碼
登入
