登入

跳至 : 概要書目資訊主題

Electronic packaging.

概要

作品:	22 作品在 6 項出版品 6 種語言

書目資訊

Surface mount technology for concurrent engineering and manufacturing / by: (書目-語言資料,印刷品)

Modern solder technology for competitive electronics manufacturing / by: (書目-語言資料,印刷品)

Manufacturing challenges in electronic packaging / by: (書目-語言資料,印刷品)

Thermal management handbook :for electronic assemblies / by: (書目-語言資料,印刷品)

Handbook for critical cleaning / by: (書目-語言資料,印刷品)

Thermal design of electronic equipment / by: (書目-語言資料,印刷品)

Electronic packaging of high speed and microwave circuitry / by: (書目-語言資料,印刷品)

Thin film technology handbook / by: (書目-語言資料,印刷品)

Circuits, interconnections, and packaging for VLSI / by: (書目-語言資料,印刷品)

Package electrical modeling, thermal modeling, and processing for GaAs wireless applications / by: (書目-語言資料,印刷品)

主題

Concurrent engineering.

Manufacturing processes.

Nanostructured materials.

Chemistry.

Biophysics and Biological Physics.

Solid State Physics.

Solder and soldering.

Boundary scan testing.

Bioelectronics.

Nanotechnology.

Biomedical Engineering.

Semiconductor lasers.

Energy Systems.

Biomedical Engineering and Bioengineering.

Electromagnetic compatibility.

Printed circuits

Electronic apparatus and appliances

Electric contacts

Electronics and Microelectronics, Instrumentation.

Adhesives

Wireless communication systems

Nanophotonics.

Spectroscopy and Microscopy.

Multichip modules (Microelectronics)

Microwave devices

Gallium arsenide semiconductors

Electrochemistry.

Circuits and Systems.

Materials Science, general.

Power Electronics, Electrical Machines and Networks.

Energy Harvesting.

Electronic packaging.

Surface preparation.

Power electronics.

Insulation (Heat)

Energy.

Surface mount technology.

Surface chemistry.

Thin film devices

Thin films.

Engineering.

Optical and Electronic Materials.

Materials.

Physics.

Engineering Thermodynamics, Heat and Mass Transfer.

Integrated circuits

Heat

Electronic Circuits and Devices.