Languages
陳奕良
Overview
Works: | 1 works in 2 publications in 1 languages |
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Titles
覆晶封裝中底膠材料之最佳化材料參數研究 = The Optimization of Underfill Material for Flip Chip Packaging
by:
國立高雄大學電機工程學系碩士班; 陳奕良
(Language materials, printed)
, [撰]