王聰銘

Overview

Works:	1 works in 1 publications in 1 languages

Titles

錫球合金成份對BGA封裝可靠度之研究 = Study of the Effect of the Composition of Solder Ball Alloy in Ball Grid Array Package by: 國立高雄大學電機工程學系碩士班; 王聰銘 (Language materials, printed) , [撰]

Subjects