Languages
Lu, Daniel.
Overview
| Works: | 1 works in 1 publications in 1 languages | |
|---|---|---|
Titles
Electrical conductive adhesives with nanotechnologies
by:
Li, Yi.; Lu, Daniel.; SpringerLink (Online service); Wong, C. P.
(Electronic resources)
Materials for advanced packaging
by:
Lu, Daniel.; SpringerLink (Online service); Wong, C.P.
(Electronic resources)
Materials for advanced packaging
by:
Lu, Daniel.; SpringerLink (Online service); Wong, C.P.
(Electronic resources)
Subjects
Nanostructured materials.
Nanotechnology.
Solder and soldering.
Material Science.
Electronics and Microelectronics, Instrumentation.
Adhesives
Packaging
Circuits and Systems.
Materials Science, general.
Metallic Materials.
Electronic packaging.
Nanotechnology and Microengineering.
Microelectronic packaging.
Optical and Electronic Materials.
Engineering.