Languages
謝清俊
Overview
| Works: | 3 works in 3 publications in 1 languages | |
|---|---|---|
Titles
BGA(球柵陣列)電子構裝中基板裸露金區對膠體脫層影響之研究 = The Study Of Delaminating At Interface Between Molding Compound And Gold Substrate Bond Pad In BGA(Ball Grid Array) Package
by:
國立高雄大學電機工程學系碩士班; 謝清俊
(Language materials, printed)
, [撰]