郭邦暐

Overview

Works:	1 works in 1 publications in 1 languages

Titles

大尺寸覆晶封裝製程中底膠填充材料對翹曲之參數研究 = The Study of Underfill Material and Parameters for Large Scale Flip Chip Packages by: 國立高雄大學電機工程學系碩士班; 郭邦暐 (Language materials, printed) , [撰]

Subjects

Flip Chip 覆晶