翁肇鴻

Overview

Works:	1 works in 1 publications in 1 languages

Titles

2.5D多層覆晶封裝底膠填充材料之研究 = Study of Under-Filled Materials for 2.5DIC Flip Chip by: 國立高雄大學電機工程學系--工業技術整合產業研發碩士專班; 翁肇鴻 (Language materials, printed) , [撰]

Subjects

2.5DIC