Languages
趙昱翔
Overview
| Works: | 1 works in 1 publications in 1 languages | |
|---|---|---|
Titles
雷射鑽孔反應曲面法與鑽孔型式於改善封裝製程良率之研究 = The Improvement of Yield in Flip Chip Package by Using Response Surface Method of Laser Ablation and Drilling Structure
by:
國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班; 趙昱翔
(Language materials, printed)
, [撰]
Subjects