高宗鵬

Overview

Works:	2 works in 1 publications in 1 languages

Titles

堆疊式封裝產品翹曲問題之基板中介層設計探討 = The Study of Warpage for Package On Package Product Based on Substrate Interposer Design by: 國立高雄大學電機工程學系--電子構裝整合技術產業碩士專班; 高宗鵬 (Language materials, printed) , [撰]

Subjects