Languages
周珮毓
Overview
| Works: | 1 works in 1 publications in 1 languages | |
|---|---|---|
Titles
應用精實六標準差探討半導體封裝製程的改善與優化 = Applying Lean Six Sigma to Study the Improvement and Optimization of Semiconductor Packaging Process : 以P公司為例; The Case of the P Company
by:
周珮毓; 國立高雄大學亞太工商管理學系碩士班
(Language materials, printed)
, [撰]