陳勃勳

Overview

Works:	1 works in 1 publications in 1 languages

Titles

改善封模膠體脫層之覆晶基板設計研究 = The Improvement of Molding Compound Delaminationby Flip Chip Substrate Design by: 國立高雄大學電機工程學系--電子構裝整合技術產業碩士專班; 陳勃勳 (Language materials, printed) , [撰]

Subjects