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Fan, X. J.

Overview

Works:	1 works in 1 publications in 1 languages

Titles

Hybrid bonding, advanced substrates, failure mechanisms, and thermal management for chiplets and heterogeneous integration by: Fan, X. J.; Lau, John.; SpringerLink (Online service) (Electronic resources)

Subjects

Electronics Design and Verification. Semiconductors. Printed circuits Adhesives. Electronics and Microelectronics, Instrumentation. Process Engineering. Integrated circuits

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