張傑琍

Overview

Works:	0 works in 1 publications in 1 languages

Titles

迴焊爐環境因子對錫球結球製程良率改之善探討 = Yield Improvement Study of Environmental Factors for Solder Bump Reflow Process by: 國立高雄大學電機工程學系--電子構裝整合技術產業碩士專班; 國立高雄大學電機工程學系碩士班; 張傑琍 (Language materials, printed) , [撰]

Subjects