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陳勃勳

Overview
Works: 2 works in 1 publications in 1 languages
Titles
改善封模膠體脫層之覆晶基板設計研究 = The Improvement of Molding Compound Delaminationby Flip Chip Substrate Design by: 國立高雄大學電機工程學系--電子構裝整合技術產業碩士專班; 陳勃勳 (Language materials, printed) , [撰]
 
 
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