劉瑋淮

Overview

Works:	0 works in 1 publications in 1 languages

Titles

扇出型球閘陣列封裝凸塊焊接及平面度問題改進研究 = The Improvement of Bump Joint and Coplanarity of Fan-out Ball Grid Array Package by: 劉瑋淮; 國立高雄大學電機工程學系--電子構裝整合技術產業碩士專班; 國立高雄大學電機工程學系碩士班 (Language materials, printed) , [撰]

Subjects