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構裝材料之電氣特性萃取技術 = Electrical Performan...

國立高雄大學電機工程學系碩士班

構裝材料之電氣特性萃取技術 = Electrical Performance Extracting Technology for Packaging material

紀錄類型:	書目-語言資料,印刷品 : 單行本
並列題名:	Electrical Performance Extracting Technology for Packaging material
作者:	賴啟彰,
其他團體作者:	國立高雄大學
出版地:	[高雄市]
出版者:	撰者;
出版年:	2008[民97]
面頁冊數:	80面圖，表 : 30公分;
標題:	材料特性
標題:	material property
電子資源:	http://handle.ncl.edu.tw/11296/ndltd/69915944530489491720
附註:	指導教授：吳松茂
附註:	參考書目：面64-65
摘要註:	本論文提出構裝材料之電氣特性萃取技術，藉由微帶線(Microstrip Line)的相位延遲(phase delay)與功率損耗(power loss)等相關原理與實際量測數據，在Agilent公司的 ADS (Advanced Design System) 軟體平台上進行電性分析與推導材料特性參數，所萃取的參數主要為介電常數(Dielectric Constant)與損耗正切(Loss Tangent) ，量測與模擬頻段範圍為50 MHz到20.05 GHz。實驗過程中，萃取到合理的材料參數，並且如預期分析得到材料參數隨頻率變化的結果，實現藉由量測與理論推導而得的萃取技術。最後將萃取材料參數的頻率響應，代回Ansoft 公司的3D電磁場模擬軟體HFSS (High Frequency Structure Simulator)中進行電磁模擬，將模擬結果與量測進行比對驗證，加以驗證萃取的材料參數之準確性。 For multi-chip and system integrated in one packaging, analysis techniques of substrate circuit for System-in-Packaging design are demanded violently in recent years. For this reason, accurately electrical parameters of packaging substrate materials affect mainly system performance during design stage. Incorrect properties of material will bring on confused design for active or passive devices in microwave/RF application. Therefore, accurate electrical parameters of substrate materials varying with frequency lead correct electrical performance design and fast time to market during design stage.In this thesis, organic material using for packaging substrate is selected and multi-length microstrip lines in same trace width are designed and performed on it. Novel formulas deliver to extract effective dielectric constant, dielectric constant, phase constant, attenuation constant, skin depth, and loss tangent varying with frequency for selected organic materials will be shown in this thesis. Performances of microstrip lines are measured by Agilent Vector Network Analyzer up to 20GHz and SOLT calibration used to get multi-port S-parameters. Then, novel formulas are used to extract material parameters in ADS software by measurement date. Next, microstrip line frequency responses are comparing and discussing with real case measurement, EM solver extracting with unity material parameters setting, and EM solver extracting with frequency varying material parameters setting.

構裝材料之電氣特性萃取技術 = Electrical Performance Extracting Technology for Packaging material
賴, 啟彰

構裝材料之電氣特性萃取技術 = Electrical Performance Extracting Technology for Packaging material / 賴啟彰撰 - [高雄市] : 撰者, 2008[民97]. - 80面 ; 圖，表 ; 30公分.
指導教授：吳松茂參考書目：面64-65.
材料特性material property

構裝材料之電氣特性萃取技術 = Electrical Performance Extracting Technology for Packaging material
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