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含微量鎳或鍺之錫銀銅錫球接點衝球試驗特性研究 = A Study of ...

國立高雄大學電機工程學系碩士班

含微量鎳或鍺之錫銀銅錫球接點衝球試驗特性研究 = A Study of Ball Impact Test Characteristics of Sn-Ag-Cu Solder Joints Doped with Nickel or Germanium

紀錄類型:	書目-語言資料,印刷品 : 單行本
並列題名:	A Study of Ball Impact Test Characteristics of Sn-Ag-Cu Solder Joints Doped with Nickel or Germanium
作者:	張效銓,
其他團體作者:	國立高雄大學
出版地:	[高雄市]
出版者:	撰者;
出版年:	2009[民98]
面頁冊數:	10, 77面圖，表 : 30公分;
標題:	錫球
標題:	solder ball
電子資源:	http://handle.ncl.edu.tw/11296/ndltd/37792904842030094511
附註:	參考書目：面64-67
附註:	附錄
摘要註:	本論文之錫球衝擊試驗可量化錫球接點結構在高速剪力荷載下之結構強度與性質，且與上板掉落衝擊可靠度有相當程度的正相關性。本研究即以錫球衝擊試驗針對不同無鉛錫球成份、表面處理與錫球接點結構狀態進行測試，在500 釐米/秒之衝擊速度，對其所反應之暫態結構響應進行解析，針對實驗組合的抗掉落衝擊能力與性質進行評估，並利用統計軟體，進行顯著性差異檢定，以取得客觀之結果。本研究針對結構破裂模式、接點結構特性與接點組成成分進行討論。本實驗參雜鎳或鍺之錫球，在化錫表面處理與植球後不迴銲，其接點結構強度與延性皆有顯著之提升，而在接點組成上，鎳改變介金屬化合物之組成，而鍺則強化錫球本身之機械性質。 The Ball impact test (BIT) itself stands alone as a unique and novel test methodology in characterizing strengths of solder joints structure under a high-speed shearing load with quantification, and is positive correlations with board level drop reliability. In this study, we present BIT responses and analysis obtained at an impact velocity of 500mm/s on package-level solder joints. The different solder composition joints are bonded on substrate pads of either immersion tin or direct solder on pad surface finishes, through muti-reflow for different solder joint situation. The BIT results are applied with significant difference test for objectivity with statistic confirmation. In this study, the BIT results indicate that better reliability can be achieved by adopting Sn-Ag-Cu solder alloys, Immersion Tin substrate pad finish and no additional reflow. Moreover, the addition of Ni or Ge to the solder alloy provides a large improvement; Ni alters the interfacial IMC structure while Ge enhances the mechanical behavior of the bulk solder.

含微量鎳或鍺之錫銀銅錫球接點衝球試驗特性研究 = A Study of Ball Impact Test Characteristics of Sn-Ag-Cu Solder Joints Doped with Nickel or Germanium
張, 效銓

含微量鎳或鍺之錫銀銅錫球接點衝球試驗特性研究 = A Study of Ball Impact Test Characteristics of Sn-Ag-Cu Solder Joints Doped with Nickel or Germanium / 張效銓撰 - [高雄市] : 撰者, 2009[民98]. - 10, 77面 ; 圖，表 ; 30公分.
參考書目：面64-67附錄.
錫球solder ball

含微量鎳或鍺之錫銀銅錫球接點衝球試驗特性研究 = A Study of Ball Impact Test Characteristics of Sn-Ag-Cu Solder Joints Doped with Nickel or Germanium
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330 $a 本論文之錫球衝擊試驗可量化錫球接點結構在高速剪力荷載下之結構強度與性質，且與上板掉落衝擊可靠度有相當程度的正相關性。本研究即以錫球衝擊試驗針對不同無鉛錫球成份、表面處理與錫球接點結構狀態進行測試，在500 釐米/秒之衝擊速度，對其所反應之暫態結構響應進行解析，針對實驗組合的抗掉落衝擊能力與性質進行評估，並利用統計軟體，進行顯著性差異檢定，以取得客觀之結果。本研究針對結構破裂模式、接點結構特性與接點組成成分進行討論。本實驗參雜鎳或鍺之錫球，在化錫表面處理與植球後不迴銲，其接點結構強度與延性皆有顯著之提升，而在接點組成上，鎳改變介金屬化合物之組成，而鍺則強化錫球本身之機械性質。 The Ball impact test (BIT) itself stands alone as a unique and novel test methodology in characterizing strengths of solder joints structure under a high-speed shearing load with quantification, and is positive correlations with board level drop reliability. In this study, we present BIT responses and analysis obtained at an impact velocity of 500mm/s on package-level solder joints. The different solder composition joints are bonded on substrate pads of either immersion tin or direct solder on pad surface finishes, through muti-reflow for different solder joint situation. The BIT results are applied with significant difference test for objectivity with statistic confirmation. In this study, the BIT results indicate that better reliability can be achieved by adopting Sn-Ag-Cu solder alloys, Immersion Tin substrate pad finish and no additional reflow. Moreover, the addition of Ni or Ge to the solder alloy provides a large improvement; Ni alters the interfacial IMC structure while Ge enhances the mechanical behavior of the bulk solder.
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