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Lateral piezoresistive accelerometer with epipoly encapsulation.

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Lateral piezoresistive accelerometer with epipoly encapsulation.
作者:	Partridge, Aaron.
面頁冊數:	143 p.
附註:	Adviser: Thomas W. Kenny.
附註:	Source: Dissertation Abstracts International, Volume: 64-05, Section: B, page: 2325.
Contained By:	Dissertation Abstracts International64-05B.
標題:	Engineering, Electronics and Electrical.
電子資源:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3090656
ISBN:	0496383787

Lateral piezoresistive accelerometer with epipoly encapsulation.
Partridge, Aaron.

Lateral piezoresistive accelerometer with epipoly encapsulation. [electronic resource] - 143 p.

Adviser: Thomas W. Kenny.

Thesis (Ph.D.)--Stanford University, 2003.

In addition, micromachined accelerometers often suffer from packaging deficiencies, especially from the bonded covers or chip carriers required to protect their delicate structures. The common packaging often negates the sensor's potential size and cost benefits and limits their applications. This thesis presents a new encapsulation that encloses the accelerometers under epipoly (epitaxially deposited polysilicon) and protects them from mechanical and environmental damage. The encapsulation also provides electronic benefits, with encapsulated piezoresistors showing exceptionally low noise. This produces high performance accelerometers and supports conventional semiconductor post-processing, such as dicing, vacuum pick and place, wire bonding, and other standard handling and mounting techniques. The finished encapsulated accelerometers endure a much wider variety of final packaging than unencapsulated accelerometers.

ISBN: 0496383787Subjects--Topical Terms:

226981
Engineering, Electronics and Electrical.

Lateral piezoresistive accelerometer with epipoly encapsulation.
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502 $a Thesis (Ph.D.)--Stanford University, 2003.
520 # $a In addition, micromachined accelerometers often suffer from packaging deficiencies, especially from the bonded covers or chip carriers required to protect their delicate structures. The common packaging often negates the sensor's potential size and cost benefits and limits their applications. This thesis presents a new encapsulation that encloses the accelerometers under epipoly (epitaxially deposited polysilicon) and protects them from mechanical and environmental damage. The encapsulation also provides electronic benefits, with encapsulated piezoresistors showing exceptionally low noise. This produces high performance accelerometers and supports conventional semiconductor post-processing, such as dicing, vacuum pick and place, wire bonding, and other standard handling and mounting techniques. The finished encapsulated accelerometers endure a much wider variety of final packaging than unencapsulated accelerometers.
520 # $a The methods presented in this thesis solve many longstanding problems in Micro Electro Mechanical Systems (MEMS). The oblique implantation on flexure sidewalls applies to inertial sensors and strain sensors in general. The epipoly encapsulation enables a variety of applications in sensors, actuators, resonators, and many other MEMS devices.
520 # $a The micromachined piezoresistive accelerometer was introduced by Roylance and Angel in 1977. Since then the majority of piezoresistive accelerometers have been built with the same topology, but important shortcomings of the original design have not been adequately addressed. This thesis presents a new accelerometer topology that combines advantages of the Bosch Etch process (also called Deep Reactive Ion Etching, DRIE) and obliquely implanted piezoresistors on flexure sidewalls to form a new category of high resolution robust accelerometers.
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