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Chip scale package (CSP) :design, ma...

Lau, John H.

Chip scale package (CSP) :design, materials, processes, reliability, and applications /

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
正題名/作者:	Chip scale package (CSP) :John H. Lau, Shi-Wei Ricky Lee.
其他題名:	design, materials, processes, reliability, and applications /
作者:	Lau, John H.
其他作者:	Lee, Shi-Wei Ricky.
出版者:	New York :McGraw-Hill,c1999.
面頁冊數:	xxii, 564 p. :ill. ;24 cm.
標題:	Integrated circuitsDesign and construction.
電子資源:	http://www.loc.gov/catdir/toc/mh022/98053224.html
電子資源:	http://www.loc.gov/catdir/enhancements/fy0602/98053224-b.html
電子資源:	http://www.loc.gov/catdir/enhancements/fy0602/98053224-d.html
ISBN:	0070383049 :

Chip scale package (CSP) :design, materials, processes, reliability, and applications /
Lau, John H.

Chip scale package (CSP) :design, materials, processes, reliability, and applications /John H. Lau, Shi-Wei Ricky Lee. - New York :McGraw-Hill,c1999. - xxii, 564 p. :ill. ;24 cm.

Includes bibliographical references and index.

ISBN: 0070383049 :NT$2606

LCCN: 98053224 Subjects--Topical Terms:

184690
Integrated circuits
--Design and construction.

LC Class. No.: TK7874 / .L3167 1999

Dewey Class. No.: 621.3815

Chip scale package (CSP) :design, materials, processes, reliability, and applications /
LDR:01083nam 2200217 450 001 180169
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010 $a 98053224
020 $a 0070383049 : $c NT$2606
035 $a 00305499
040 $a DLC $c DLC $d DLC
042 $a pcc
050 0 0 $a TK7874 $b .L3167 1999
082 0 0 $2 21 $a 621.3815
100 $a Lau, John H. $3 205101
245 1 0 $a Chip scale package (CSP) : $b design, materials, processes, reliability, and applications / $c John H. Lau, Shi-Wei Ricky Lee.
260 $a New York : $c c1999. $b McGraw-Hill,
300 $a xxii, 564 p. : $b ill. ; $c 24 cm.
504 $a Includes bibliographical references and index.
650 $a Integrated circuits $x Design and construction. $3 184690
650 $a Microelectronic packaging. $3 182088
700 $a Lee, Shi-Wei Ricky. $3 263523
856 4 1 $3 Table of contents only $u http://www.loc.gov/catdir/toc/mh022/98053224.html $z http://www.loc.gov/catdir/toc/mh022/98053224.html
856 4 2 $3 Contributor biographical information $u http://www.loc.gov/catdir/enhancements/fy0602/98053224-b.html $z http://www.loc.gov/catdir/enhancements/fy0602/98053224-b.html
856 4 2 $3 Publisher description $u http://www.loc.gov/catdir/enhancements/fy0602/98053224-d.html $z http://www.loc.gov/catdir/enhancements/fy0602/98053224-d.html

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http://www.loc.gov/catdir/toc/mh022/98053224.html
http://www.loc.gov/catdir/enhancements/fy0602/98053224-b.html
http://www.loc.gov/catdir/enhancements/fy0602/98053224-d.html

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