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IC導線架剪切製程之沖頭壽命研究 = Study on Punch Li...

國立高雄大學電機工程學系--工業技術整合產業研發碩士專班

IC導線架剪切製程之沖頭壽命研究 = Study on Punch Life of IC Lead Frame Stamping Process

紀錄類型:	書目-語言資料,印刷品 : 單行本
並列題名:	Study on Punch Life of IC Lead Frame Stamping Process
作者:	曾耀進,
其他團體作者:	國立高雄大學
出版地:	[高雄市]
出版者:	撰者;
出版年:	民99[2010]
面頁冊數:	95面圖，表 : 30公分;
標題:	IC導線架
標題:	IC lead frame
電子資源:	http://handle.ncl.edu.tw/11296/ndltd/54284492303499763363
摘要註:	以往模具業者常以碳化鎢為連續沖模之沖頭材料，但長時間高速的沖壓下，沖頭會因與材料長期摩擦生熱與微小的細屑作用等而使表面磨耗與粗糙，縱使碳化鎢有極高的硬度也無法避免碳化鎢成份的鈷與材料產生親合作用，進而發生嚴重的摩擦而加快磨耗的速度，而陶瓷材料雖然硬度與抗折強度不如碳化鎢，但其摩擦係數低不會與材料產生嚴重的摩擦損耗，本文主要在探討陶瓷沖頭和碳化鎢沖頭應用於IC導線架剪切工程，從材料的成本、高品質化、高效率化發展，比較陶瓷沖頭與碳化鎢沖頭沖壓壽命並做成本分析，本文主要選用L9(34)的實驗計畫表以沖頭的寬度、高度、圓角、長度做為模擬參數，利用ANSYS有限元素分析軟體對陶瓷沖頭與碳化鎢沖頭做壽命分析，並應用田口實驗法對各種模擬數據做最佳化的分析，而由回應表及回應圖找出最佳壽命的沖頭設計，經成本評估而得到最低的成本和最高的效益，進而得到最佳沖頭的幾何形狀，並經由沖壓實驗來做最終的品質確認，從以上實驗分析的結果得知陶瓷沖頭應用於IC導線架剪切是最合乎成本與效益，其最佳化的沖頭幾何形狀設計可作為從事IC導線架沖切業者的重要參考與依據。 Since the tool maker often take the carbide as the stamping punch material for a long history，however during the high speed and long time stamping，the punch was easy with surface wear out , and the material long-term friction heat generation and the small fines effect , even though carbide with the extremely hardness still can’t avoid the cobalt and copper affinity effect，therefore to cause serious tribology and speed up the parts wear out , though the ceramic material ，its hardness and transverse rupture strength is inferior to carbide ，but the friction coefficient is lower and not easy to create the serious wear out on the surface , this report will explore and focus on the ceramic punch be applied on IC lead frame stamping process ，from material cost, the quality improvement, the high efficiency development, and make the cost analysis compared with the ceramic and the carbide ； our research take L9(34) experiment plan by choosing punch width 、height 、corner arc 、length as the 4 simulation parameter ，utilize the ANSYS software to do the analysis about ceramic and carbide punch life for benchmark ，and makes the optimization using the Taguchi method to arrange the different parameter for experiment ，in order to find the better punch life and cost saving optimal setting parameter, through the noise reaction ration chart and table analysis , obtains the lowest cost after the cost appraisal and the highest benefit, then obtains the best geometrical shape , and verify the final quality performance , from the above laboratory procedure knew that the ceramic applied in the IC lead frame stamping project feasibility, and knew that its cost and the benefit, may share to engaged in IC lead frame entrepreneur's important reference and the basis.

IC導線架剪切製程之沖頭壽命研究 = Study on Punch Life of IC Lead Frame Stamping Process
曾, 耀進

IC導線架剪切製程之沖頭壽命研究 = Study on Punch Life of IC Lead Frame Stamping Process / 曾耀進撰 - [高雄市] : 撰者, 民99[2010]. - 95面 ; 圖，表 ; 30公分.
參考書目：面.
IC導線架IC lead frame

IC導線架剪切製程之沖頭壽命研究 = Study on Punch Life of IC Lead Frame Stamping Process
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