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微型投影機晶片液態封膠最佳化之研究 = Study of Optimum...

古順延

微型投影機晶片液態封膠最佳化之研究 = Study of Optimum Encapsulation for Mini-Projector

紀錄類型:	書目-語言資料,印刷品 : 單行本
並列題名:	Study of Optimum Encapsulation for Mini-Projector
作者:	古順延,
其他團體作者:	國立高雄大學
出版地:	[高雄市]
出版者:	撰者;
出版年:	民99[2010]
面頁冊數:	80面圖，表 : 30公分;
標題:	脫層
標題:	Delamination
電子資源:	http://handle.ncl.edu.tw/11296/ndltd/94539872080172617119
摘要註:	因微型投影機晶片液態封膠經可靠度驗證和電性測試後，發現有功能失效的問題，經過失敗模式分析，發現封膠膠材靠近基板處有脫層的問題。文中以魚骨圖分析得知封膠膠材與金屬框的型式是影響功能失效的因子，而經應力模擬得知，起因於是金屬框的膨脹係數與封膠膠材及基板的差異過大。因此本文以封膠膠材與金屬框的型式為因子，設計實驗交叉比對驗證，並經翹曲量測與應力模擬分析加以互相驗證，得到（1）新型封膠膠材能通過可靠度測試，解決膨脹係數差異過大的問題。（2）經翹曲量測與應力模擬分析，瞭解新型封膠膠材因熱應力較其抗拉強度小，能改善基板的變形量與解決脫層的問題。 Liquid encapsulant is used to protect gold wires and chips to avoid ambient effects such as particles or moisture. It also provides good reliability results in the mini-projector chips encapsulation process. However, it easily causes the delamination due to CTE mismatch after temperature cycling test and induces package functional failure. This thesis is to study the encapsulation process by different metal frames and encapsulant materials to solve CTE mismatch between the substrate, the metal frame and the liquid encapsulant experiment. At the same time, the stress simulation was demostrated to analyze the stress distribution and the experimental results were verified. From the study, several conclusions are obtained: (1) New liquid encapsulant can be used to solve CTE mismatch and pass O/S test after TCT testing. (2) By warpage measurements and the stress simulation, the overall warpage is improved with new liquid encapsulant.

微型投影機晶片液態封膠最佳化之研究 = Study of Optimum Encapsulation for Mini-Projector
古, 順延

微型投影機晶片液態封膠最佳化之研究 = Study of Optimum Encapsulation for Mini-Projector / 古順延撰 - [高雄市] : 撰者, 民99[2010]. - 80面 ; 圖，表 ; 30公分.
參考書目：面.
脫層Delamination

微型投影機晶片液態封膠最佳化之研究 = Study of Optimum Encapsulation for Mini-Projector
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330 $a 因微型投影機晶片液態封膠經可靠度驗證和電性測試後，發現有功能失效的問題，經過失敗模式分析，發現封膠膠材靠近基板處有脫層的問題。文中以魚骨圖分析得知封膠膠材與金屬框的型式是影響功能失效的因子，而經應力模擬得知，起因於是金屬框的膨脹係數與封膠膠材及基板的差異過大。因此本文以封膠膠材與金屬框的型式為因子，設計實驗交叉比對驗證，並經翹曲量測與應力模擬分析加以互相驗證，得到（1）新型封膠膠材能通過可靠度測試，解決膨脹係數差異過大的問題。（2）經翹曲量測與應力模擬分析，瞭解新型封膠膠材因熱應力較其抗拉強度小，能改善基板的變形量與解決脫層的問題。 Liquid encapsulant is used to protect gold wires and chips to avoid ambient effects such as particles or moisture. It also provides good reliability results in the mini-projector chips encapsulation process. However, it easily causes the delamination due to CTE mismatch after temperature cycling test and induces package functional failure. This thesis is to study the encapsulation process by different metal frames and encapsulant materials to solve CTE mismatch between the substrate, the metal frame and the liquid encapsulant experiment. At the same time, the stress simulation was demostrated to analyze the stress distribution and the experimental results were verified. From the study, several conclusions are obtained: (1) New liquid encapsulant can be used to solve CTE mismatch and pass O/S test after TCT testing. (2) By warpage measurements and the stress simulation, the overall warpage is improved with new liquid encapsulant.
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