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晶圓級封裝體於落下試驗之田口法最佳化分析 = The Study of ...

國立高雄大學電機工程學系碩士班

晶圓級封裝體於落下試驗之田口法最佳化分析 = The Study of Parameter Optimization of Wafer Level Chip Scale Packages in Board Level Drop Test with Taguchi's Method.

紀錄類型:	書目-語言資料,印刷品 : 單行本
並列題名:	The Study of Parameter Optimization of Wafer Level Chip Scale Packages in Board Level Drop Test with Taguchi's Method.
作者:	蔡俊弘,
其他團體作者:	國立高雄大學
出版地:	[高雄市]
出版者:	撰者;
出版年:	民99[2010]
面頁冊數:	85面圖，表 : 30公分;
標題:	晶圓級封裝體
標題:	WLCSP
電子資源:	http://handle.ncl.edu.tw/11296/ndltd/13632727425919086480
摘要註:	本次研究是將晶圓級封裝體（WLCSP）依照經驗法則與目前業界的製程水準，進行多方面製程的組合設計，並使用田口方法來規劃實驗流程，以找出如何提升錫球接點能夠承受落下衝擊強度的關鍵因素，以及最佳的組合設計。本次研究所針對的製程設計實驗條件為晶片尺寸、晶片厚度、錫球成分及錫球直徑。根據田口方法模式，此四組實驗條件即為控制因子，而這四組控制因子皆有三組變動水準，利用此配對來找出對品質特性影響最大的控制因子，進而分析出最佳的配對組合。本次研究所針對的製程設計之控制因子對品質特性的影響大小依序為晶片尺寸＞晶片厚度＞錫球成分＞錫球直徑。再藉由變異數分析法，得到最佳設計組合為4.0 × 4.0 mm2的晶片尺寸、0.4 mm的晶片厚度、SAC105的錫球成分以及0.25 mm的錫球直徑。 The study of the Wafer Level Chip Scale Packages（WLCSP）was carried out with reference to past experience in the laboratory and current industry standard as an effort to analyze various combinations of the multi-stages manufacturing processes of WLCSP. To find out the driving force that could improve the sustainability of the solder ball joints against the power of drop impact and the optimum process in making WLCSP, Taguchi's method was applied to plan out the experimentation. The materials tested and subjected to variations are the size and the thickness of Die, the composition of Solder ball, and the Ball’s diameter. According to Taguchi’s Method, the four variables aforementioned are the factors and each of them has three additional moving elements. The experimentation was designed to first discover the most influential factors, then adjust those factors, and thereby achieve the optimal combination. The ranking of influence of four factors determined in this study are Die size＞Die thickness＞Solder ball type＞Ball diameter. With further assistance from ANOVA analysis, the best design achieved is Die size of 4.0 4.0 mm2, Die thickness of 0.4 mm, Solder ball type of SAC105, and Ball diameter of 0.25 mm.

晶圓級封裝體於落下試驗之田口法最佳化分析 = The Study of Parameter Optimization of Wafer Level Chip Scale Packages in Board Level Drop Test with Taguchi's Method.
蔡, 俊弘

晶圓級封裝體於落下試驗之田口法最佳化分析 = The Study of Parameter Optimization of Wafer Level Chip Scale Packages in Board Level Drop Test with Taguchi's Method. / 蔡俊弘撰 - [高雄市] : 撰者, 民99[2010]. - 85面 ; 圖，表 ; 30公分.
參考書目：面.
晶圓級封裝體WLCSP

晶圓級封裝體於落下試驗之田口法最佳化分析 = The Study of Parameter Optimization of Wafer Level Chip Scale Packages in Board Level Drop Test with Taguchi's Method.
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330 $a 本次研究是將晶圓級封裝體（WLCSP）依照經驗法則與目前業界的製程水準，進行多方面製程的組合設計，並使用田口方法來規劃實驗流程，以找出如何提升錫球接點能夠承受落下衝擊強度的關鍵因素，以及最佳的組合設計。本次研究所針對的製程設計實驗條件為晶片尺寸、晶片厚度、錫球成分及錫球直徑。根據田口方法模式，此四組實驗條件即為控制因子，而這四組控制因子皆有三組變動水準，利用此配對來找出對品質特性影響最大的控制因子，進而分析出最佳的配對組合。本次研究所針對的製程設計之控制因子對品質特性的影響大小依序為晶片尺寸＞晶片厚度＞錫球成分＞錫球直徑。再藉由變異數分析法，得到最佳設計組合為4.0 × 4.0 mm2的晶片尺寸、0.4 mm的晶片厚度、SAC105的錫球成分以及0.25 mm的錫球直徑。 The study of the Wafer Level Chip Scale Packages（WLCSP）was carried out with reference to past experience in the laboratory and current industry standard as an effort to analyze various combinations of the multi-stages manufacturing processes of WLCSP. To find out the driving force that could improve the sustainability of the solder ball joints against the power of drop impact and the optimum process in making WLCSP, Taguchi's method was applied to plan out the experimentation. The materials tested and subjected to variations are the size and the thickness of Die, the composition of Solder ball, and the Ball’s diameter. According to Taguchi’s Method, the four variables aforementioned are the factors and each of them has three additional moving elements. The experimentation was designed to first discover the most influential factors, then adjust those factors, and thereby achieve the optimal combination. The ranking of influence of four factors determined in this study are Die size＞Die thickness＞Solder ball type＞Ball diameter. With further assistance from ANOVA analysis, the best design achieved is Die size of 4.0 4.0 mm2, Die thickness of 0.4 mm, Solder ball type of SAC105, and Ball diameter of 0.25 mm.
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