國立高雄大學圖資館 |

系統構裝效應探討與模型建立 = The System-level Package Effect Research and Modeling by Packaging Integrated Passive Device : 以整合式被動元件分析

紀錄類型:	書目-語言資料,印刷品 : 單行本
並列題名:	The System-level Package Effect Research and Modeling by Packaging Integrated Passive Device
副題名:	以整合式被動元件分析
作者:	余柏輝,
其他團體作者:	國立高雄大學
出版地:	[高雄市]
出版者:	撰者;
出版年:	2012[民101]
面頁冊數:	60面圖，表 : 30公分;
標題:	系統搆裝效應分析
標題:	system-level package effect
電子資源:	http://handle.ncl.edu.tw/11296/ndltd/40247592770386020642
附註:	106年10月31日公開
附註:	參考書目：面46-48
其他題名:	以整合式被動元件分析
摘要註:	自系統級封裝被提出以來，產業界日益重視這樣議題，使用範圍亦日漸廣泛。由於系統級封裝的結構上較為複雜，導致設計整體電性效應分析需要較久的電磁模擬資源，使得在設計時程上花費相當多的時間。本論文之主要目的在於分析系統級封裝效應，建立快速準確並符合電性設計規範之系統級封裝設計並建立構裝模型；且藉由分段式寬頻構裝模型建立，提供設計者得到預期的電性效應，進一步減少產品開發的時程。本論文透過分析基板走線的長短、thermo ground ball的有無以及封裝接地環的有無，對封裝基板傳輸效應進行評估；並利用實驗室先前所建立出來的Package IP進行合成，建立封裝基板的模型，由此驗證Package IP的可行性。接著於本論文中將整合式被動元件進行封裝，並針對封裝與晶片之間的互相干擾進行分析與討論，最後提出完整的封裝等效電路模型。 Since the system-level package is proposed, the industry increasingly attach importance to such issues, the scope of its use is also becoming more widely. More complex system-level package structure, leading to the design of overall electrical effect require more electromagnetic simulation resources, so spend a lot of time in the design process. The main purpose of this paper is to analysis the effect of system-level package, and to establish system-in-package in accordance with electrical specifications. By segmented model, this paper also builds an overall model for designer to predict the electrical characteristics, thus reducing the product development schedule. In this paper, the transmission effects of substrate are analyzed by changing the length of the substrate transmission line, with or without thermo ground ball and the ground ring. Package IP previously established are synthesized to establish the model of the package substrate, which verifies the feasibility of the Package IP. Then this paper analysis the characteristics of the interference between chips and package by package the IPD, and propose the complete package equivalent circuit model.

系統構裝效應探討與模型建立 = The System-level Package Effect Research and Modeling by Packaging Integrated Passive Device : 以整合式被動元件分析
余, 柏輝

系統構裝效應探討與模型建立 = The System-level Package Effect Research and Modeling by Packaging Integrated Passive Device : 以整合式被動元件分析 / 余柏輝撰 - [高雄市] : 撰者, 2012[民101]. - 60面 ; 圖，表 ; 30公分.
106年10月31日公開參考書目：面46-48.
系統搆裝效應分析system-level package effect

系統構裝效應探討與模型建立 = The System-level Package Effect Research and Modeling by Packaging Integrated Passive Device : 以整合式被動元件分析
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