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2.5D多層覆晶封裝底膠填充材料之研究 = Study of Under...

國立高雄大學電機工程學系--工業技術整合產業研發碩士專班

2.5D多層覆晶封裝底膠填充材料之研究 = Study of Under-Filled Materials for 2.5DIC Flip Chip

紀錄類型:	書目-語言資料,印刷品 : 單行本
並列題名:	Study of Under-Filled Materials for 2.5DIC Flip Chip
作者:	翁肇鴻,
其他團體作者:	國立高雄大學
出版地:	[高雄市]
出版者:	國立高雄大學;
出版年:	2015[民104]
面頁冊數:	[10]，59葉圖，表 : 30公分;
標題:	2.5DIC
標題:	2.5DIC
電子資源:	https://hdl.handle.net/11296/99n67n
附註:	110年4月20日公開
附註:	參考書目：葉47
摘要註:	本論文研究主軸為先進2.5DIC覆晶封裝製程中,內部訊號連接點保護之底膠填充材料選擇。在先進2.5DIC覆晶封裝結構下,晶片與晶片間的訊號連接通常是使用無鉛錫球凸塊(C4 Bump )或者是表面塗佈無鉛錫之銅柱凸塊(Cu Pillar Bump)進行接合,接合過程採用迴焊爐(Reflow Oven)製程使無鉛錫熔融連接,以達到晶片與晶片間訊號的傳遞。然而為了保護晶片間訊號傳遞的接點,產品必須選擇合適的底膠填充材料來保護,而底膠填充材料的選擇以及材料特性之選用將影響封裝後產品可靠度,進而影響封裝能力品質。在本研究中,玻璃轉移溫度(Tg)和楊氏係數(Young's Modulus)為主要探討的材料特性。實驗定義玻璃轉移溫度(Tg)為大於和小於100℃兩個條件;楊氏係數(Young's Modulus)則為大於和小於9GPa兩個條件,並使用田口實驗法排列全因子實驗表,選擇符合各組因子搭配之底膠填充材料。完成覆晶封裝底膠填充製程後,進行可靠度驗證與前條件測試(Pre-condition)並以超音波掃瞄顯微鏡(Scanning Acoustic Tomography, SAT)檢查測試樣品。以JMP統計軟體分析實驗結果發現,當玻璃轉移溫度(Tg)為小於100℃以及楊氏係數(Young's Modulus)小於9GPa時,可以明顯降低應力(Stress)與應變(Strains)對於2.5DIC覆晶封裝結構所造成的破壞。 This study is about the choice of under-filling materials protected connection point for 2.5DIC flip chip packaging process. For the current 2.5DIC flip chip package, the signal connection between two chips typically use lead-free solder ball bumps (C4 Bump) or a surface coated with lead-free solder in the copper pillar bumps (Cu Pillar Bump). In the bonding process, a reflow oven is used for the molten lead-free solder connection to achieve signal transfers between the chips. However, in order to protect the contacts of signal transmission between chips, the right under-filling material must be chosen to protect the bottom. Once the chosen primer and filler material was used in lead-free solder ball bumps (C4 Bump) process, the qualities, the reliabilities and the different characteristics of the material or surface coating of copper pillar solder unprotected bumps (Cu Pillar Bump) were checked. In this study, the glass transition temperature (Tg) and Young's Modulus are the key material properties. Experimental condition of the glass transition temperature (Tg) is defined greater and less than 100℃. Young's Modulus is defined greater and less than 9Pa. The Taguchi method design is used to have a full factorial DoE table for choosing the right under-filled material based on the conditions of two key factors. After the whole flip chip under-fill filling process, the reliability test, pre-conditioning and SAT are checked and verified. According to the JMP statistical analysis results, it is found that when the glass transition temperature (Tg) is less than 100℃ and Young's Modulus is less than 9GPa can reduce the stress and strains effects for 2.5DIC flip chip package.

2.5D多層覆晶封裝底膠填充材料之研究 = Study of Under-Filled Materials for 2.5DIC Flip Chip
翁, 肇鴻

2.5D多層覆晶封裝底膠填充材料之研究 = Study of Under-Filled Materials for 2.5DIC Flip Chip / 翁肇鴻撰 - [高雄市] : 國立高雄大學, 2015[民104]. - [10]，59葉 ; 圖，表 ; 30公分.
110年4月20日公開參考書目：葉47.
2.5DIC2.5DIC

2.5D多層覆晶封裝底膠填充材料之研究 = Study of Under-Filled Materials for 2.5DIC Flip Chip
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