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Investigations on microstructure and...

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Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfacesby Qingke Zhang.
作者:	Zhang, Qingke.
出版者:	Berlin, Heidelberg :Springer Berlin Heidelberg :2016.
面頁冊數:	xv, 143 p. :ill., digital ;24 cm.
Contained By:	Springer eBooks
標題:	Lead-free electronics manufacturing processesResearch.
電子資源:	http://dx.doi.org/10.1007/978-3-662-48823-2
ISBN:	9783662488232$q(electronic bk.)

Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces
Zhang, Qingke.

Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces[electronic resource] /by Qingke Zhang. - Berlin, Heidelberg :Springer Berlin Heidelberg :2016. - xv, 143 p. :ill., digital ;24 cm. - Springer theses,2190-5053. - Springer theses..

Research Progress in Pb-free Soldering -- Fracture Behavior of IMCs at Cu/Pb-free Solder Interface -- Tensile-compress Fatigue Behavior of Solder Joints -- Shear Creep-fatigue Behavior of Cu/Pb-free Solder Joints -- Thermal Fatigue Behavior of Sn-Ag/Cu Solder Joints -- Conclusions.

This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are shown, the shear fracture strength of the Cu6Sn5 IMC is measured experimentally for the first time, and the dynamic damage process and microstructure evolution behavior of Pb-free solder joints are revealed intuitively. The thesis puts forward the argument that the local cumulative damage is the major cause of failure in solder joints. The research results provide the experimental and theoretical basis for improving the reliability of solder joints.

ISBN: 9783662488232$q(electronic bk.)

Standard No.: 10.1007/978-3-662-48823-2doiSubjects--Topical Terms:

737876
Lead-free electronics manufacturing processes
--Research.

LC Class. No.: TK7836

Dewey Class. No.: 621.381

Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces
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520 $a This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are shown, the shear fracture strength of the Cu6Sn5 IMC is measured experimentally for the first time, and the dynamic damage process and microstructure evolution behavior of Pb-free solder joints are revealed intuitively. The thesis puts forward the argument that the local cumulative damage is the major cause of failure in solder joints. The research results provide the experimental and theoretical basis for improving the reliability of solder joints.
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