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Search result for [ subject:"Microelectronic packaging."]

25 records (0.031s)· Page 1 of 3 • 1 2 3

1.

Advanced electronic packaging.

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Brown, William D., (1943-)
- Advanced electronic packaging.
- by: Brown, William D., (1943-); Ulrich, Richard K., (Ph.D.)
- Language materials, printed : Monograph/item
- Language: 英文
- Publisher: IEEE,; Wiley ;
- Place of Publication: Piscataway, NJ :
- Year of Publication: 2006
- ISBN: 0471466093; 978047146609X
- Availability: 1 Copie(s) available | 1 Copie(s) available for loan
- based on 0 review(s)
2.

Microelectronic packaging /

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Datta, Madhav.
- Microelectronic packaging /
- by: Datta, Madhav.; Osaka, Tetsuya, (1945-); Schultze, J. W.
- Language materials, printed : Monograph/item
- Publisher: CRC Press,
- Place of Publication: Boca Raton, FL :
- Year of Publication: 2005
- ISBN: 041531190X
- Availability: 1 Copie(s) available | 1 Copie(s) available for loan
- based on 0 review(s)
3.

Introduction to microsystem packagin...

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Chen, Jing, (1974-)
- Introduction to microsystem packaging technology /
- by: Chen, Jing, (1974-); Jin, Yufeng.; Wang, Zhiping, (1962- Oct. 6-)
- Language materials, printed : Monograph/item
- Publisher: CRC Press/Taylor & Francis,
- Place of Publication: Boca Raton, FL :
- Year of Publication: 2011
- ISBN: 1439819106; 9781439819104
- Availability: 1 Copie(s) available | 1 Copie(s) available for loan
- based on 0 review(s)
4.

Fundamentals of device and systems p...

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Tummala, Rao R., (1942-)
- Fundamentals of device and systems packaging :technologies and applications /
- by: Tummala, Rao R., (1942-)
- Language materials, printed : Monograph/item
- Publisher: McGraw-Hill,
- Place of Publication: New York :
- Year of Publication: 2019
- ISBN: 1259861554; 9781259861550
- Availability: 1 Copie(s) available | 1 Copie(s) available for loan
- based on 0 review(s)
5.

Chip scale package (CSP) :design, ma...

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Lau, John H.
- Chip scale package (CSP) :design, materials, processes, reliability, and applications /
- by: Lau, John H.; Lee, Shi-Wei Ricky.
- Language materials, printed : Monograph/item
- Publisher: McGraw-Hill,
- Place of Publication: New York :
- Year of Publication: 1999
- ISBN: 0070383049
- Availability: 1 Copie(s) available | 1 Copie(s) available for loan
- based on 0 review(s)
6.

Substrate integrated antennas and ar...

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Cheng, Yu Jian,
- Substrate integrated antennas and arrays /
- by: Cheng, Yu Jian,
- Language materials, printed : Monograph/item
- Year of Publication: 2016
- ISBN: 1498714536; 9781498714532
- ISSN: 22003734500
- Availability: 1 Copie(s) available | 1 Copie(s) available for loan
- based on 0 review(s)
7.

Advanced MEMS packaging

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Lau, John H.
- Advanced MEMS packaging
- by: Lau, John H.
- Electronic resources : Monograph/item
- Language: 英文
- Publisher: McGraw-Hill,
- Place of Publication: New York :
- Year of Publication: 2010
- ISBN: 0071626239; 9780071626231; 9789780071622
- Availability: 1 Copie(s) available | 1 Copie(s) available for loan
- based on 0 review(s)
8.

Low cost flip chip technologies :for...

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Lau, John H.
- Low cost flip chip technologies :for DCA, WLCSP, and PBGA assemblies /
- by: Lau, John H.
- Language materials, printed : Monograph/item
- Publisher: McGraw-Hill,
- Place of Publication: New York :
- Year of Publication: 2000
- ISBN: 0071351418
- Availability: 1 Copie(s) available | 1 Copie(s) available for loan
- based on 0 review(s)
9.

Advanced electronic packaging :with ...

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Brown, William D., (1943-)
- Advanced electronic packaging :with emphasis on multichip modules /
- by: Brown, William D., (1943-)
- Language materials, printed : Monograph/item
- Publisher: IEEE Press,
- Place of Publication: New York :
- Year of Publication: 1999
- ISBN: 0780347005
- Availability: 1 Copie(s) available | 1 Copie(s) available for loan
- based on 0 review(s)
10.

Introduction to system-on-package (S...

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Swaminathan, Madhavan.
- Introduction to system-on-package (SOP) :miniaturization of the entire system /
- by: Swaminathan, Madhavan.; Tummala, Rao R., (1942-)
- Language materials, printed : Monograph/item
- Publisher: McGraw-Hill,
- Place of Publication: New York :
- Year of Publication: 2008
- ISBN: 0071459065; 9780071459068
- Availability: 1 Copie(s) available | 1 Copie(s) available for loan
- based on 0 review(s)

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