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Electronic packaging and interconnection series
書目資訊
Multichip module technology handbook /
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Garrou, Philip E.
Multichip module technology handbook /
by:
Garrou, Philip E.
Surface mount technology for concurr...
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Classon, Frank.
Surface mount technology for concurrent engineering and manufacturing /
by:
Classon, Frank.
Modern solder technology for competi...
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Hwang, Jennie S.
Modern solder technology for competitive electronics manufacturing /
by:
Hwang, Jennie S.
Wire bonding in microelectronics :ma...
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Harman, George G.
Wire bonding in microelectronics :materials, processes, reliability, and yield /
by:
Harman, George G.
Thermal management handbook :for ele...
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Krum, Al.
Thermal management handbook :for electronic assemblies /
by:
Krum, Al.
Electronic packaging of high speed a...
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Helland, Arden R.
Electronic packaging of high speed and microwave circuitry /
by:
Helland, Arden R.
Thin film technology handbook /
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Barlow, Fred D.
Thin film technology handbook /
by:
Barlow, Fred D.
Electronic packaging and interconnec...
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Harper, Charles A.
Electronic packaging and interconnection handbook /
by:
Harper, Charles A.
Electronic connector handbook :theor...
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Mroczkowski, Robert S.
Electronic connector handbook :theory and applications /
by:
Mroczkowski, Robert S.
Electronic systems quality managemen...
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Ludwig-Becker, Marsha.
Electronic systems quality management handbook /
by:
Ludwig-Becker, Marsha.
Ball grid array technology /
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Lau, John H.
Ball grid array technology /
by:
Lau, John H.
Electronic materials and processes h...
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Harper, Charles A.
Electronic materials and processes handbook /
by:
Harper, Charles A.
Electronic assembly fabrication :chi...
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Harper, Charles A.
Electronic assembly fabrication :chips, circuit boards, packages, and components /
by:
Harper, Charles A.
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