Microelectronic packaging.
Overview
| Works: | 25 works in 9 publications in 9 languages | |
|---|---|---|
Titles
Low cost flip chip technologies :for DCA, WLCSP, and PBGA assemblies /
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(Language materials, printed)
Fundamentals of microfabrication :the science of miniaturization /
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(Language materials, printed)
Advanced electronic packaging :with emphasis on multichip modules /
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(Language materials, printed)
Chip scale package (CSP) :design, materials, processes, reliability, and applications /
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(Language materials, printed)
Introduction to system-on-package (SOP) :miniaturization of the entire system /
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(Language materials, printed)
Introduction to system-on-package (SOP) :miniaturization of the entire system /
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(Language materials, printed)
Quantum-well laser array packaging :nanoscale packaging techniques /
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(Language materials, printed)
Bio and nano packaging techniques for electron devicesadvances in electronic device packaging /
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(Electronic resources)
Die-attach materials for high temperature applications in microelectronics packagingmaterials, processes, equipment, and reliability /
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(Electronic resources)
Fundamentals of device and systems packaging :technologies and applications /
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(Language materials, printed)
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