Electronic packaging.
Overview
Works: | 22 works in 6 publications in 6 languages |
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Titles
Surface mount technology for concurrent engineering and manufacturing /
by:
(Language materials, printed)
Modern solder technology for competitive electronics manufacturing /
by:
(Language materials, printed)
Package electrical modeling, thermal modeling, and processing for GaAs wireless applications /
by:
(Language materials, printed)
Lead-free soldering in electronicsscience, technology and environmental impact /
by:
(Electronic resources)
Power electronic packagingdesign, assembly process, reliability and modeling /
by:
(Electronic resources)
Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging /
by:
(Language materials, printed)
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