Multichip modules (Microelectronics) - Design and construction.

Thermal management handbook :for electronic assemblies / by: (Language materials, printed)

Low cost flip chip technologies :for DCA, WLCSP, and PBGA assemblies / by: (Language materials, printed)

Advanced electronic packaging :with emphasis on multichip modules / by: (Language materials, printed)

System-in-package RF design and applications / by: (Language materials, printed)

Introduction to system-on-package (SOP) :miniaturization of the entire system / by: (Language materials, printed)

Introduction to system-on-package (SOP) :miniaturization of the entire system / by: (Language materials, printed)

SiP system-in-package design and simulationmentor EE flow advanced design guide / by: (Electronic resources)

MicroSystem based on SiP technology by: (Electronic resources)

Semiconductors.

Electronic apparatus and appliances

Electronics and Microelectronics, Instrumentation.

Radio frequency integrated circuits

Multichip modules (Microelectronics)

Electronic packaging.

Microelectronic packaging.

Integrated circuits

Industrial and Production Engineering.