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Subjects
Semiconductors - Failures.
Overview
Works:
4 works in 1 publications in 1 languages
Titles
Failure modes and mechanisms in electronic packages /
by:
(Language materials, printed)
Wire bonding in microelectronics
by:
(Electronic resources)
Electrical overstress (EOS)devices, circuits, and systems /
by:
(Electronic resources)
Systematische Beurteilung technischer Schadensfälle
by:
(Electronic resources)
Subjects
Electronic packaging
Wire bonding (Electronic packaging)
Transients (Electricity)
Overvoltage.
Semiconductors
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