Lau, John H.
Overview
| Works: | 1 works in 8 publications in 1 languages | |
|---|---|---|
Titles
Chip scale package (CSP) :design, materials, processes, reliability, and applications /
by:
Lau, John H.; Lee, Shi-Wei Ricky.
(Language materials, printed)
Low cost flip chip technologies :for DCA, WLCSP, and PBGA assemblies /
by:
Lau, John H.
(Language materials, printed)
Flip chip, hybrid bonding, fan-in, and fan-out technology
by:
Lau, John H.; SpringerLink (Online service)
(Electronic resources)
Electronics manufacturing :with lead-free, halogen-free, and conductive-adhesive materials /
by:
Lau, John H.
(Language materials, printed)
Chiplet design and heterogeneous integration packaging
by:
Lau, John H.; SpringerLink (Online service)
(Electronic resources)
Semiconductor advanced packaging
by:
Lau, John H.; SpringerLink (Online service)
(Electronic resources)
Assembly and reliability of lead-free solder joints
by:
Lau, John H.; Lee, Ning-Cheng.; SpringerLink (Online service)
(Electronic resources)
Fan-out wafer-level packaging
by:
Lau, John H.; SpringerLink (Online service)
(Electronic resources)
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Subjects
Ball grid array technology.
Semiconductors.
Laser Technology.
Microelectromechanical systems.
Solder and soldering.
Joints (Engineering)
Interconnects (Integrated circuit technology)
Electronic Devices.
Electronic apparatus and appliances
Electronics and Microelectronics, Instrumentation.
Microsystems and MEMS.
Multichip modules (Microelectronics)
Circuits and Systems.
Optics and Photonics.
Chip scale packaging.
Nanotechnology and Microengineering.
Microelectronic packaging.
Green products.
Engineering.
Optical and Electronic Materials.
Semiconductors
Electronic Circuits and Systems.
Environmental protection.
Integrated circuits
Integrated circuits.
Electronic Circuits and Devices.
Industrial and Production Engineering.