Languages
楊金鳳
Overview
Works: | 2 works in 2 publications in 1 languages |
---|
Titles
印刷電路板之電熱耦合分析 = Electrothermal Coupling Analysis for the Interconnects of Print Circuit Board
by:
國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班; 楊金鳳
(Language materials, printed)
, [撰]
Subjects