Languages
呂玉婷
Overview
| Works: | 1 works in 1 publications in 1 languages | |
|---|---|---|
Titles
晶圓級封裝製程中晶粒取放條件與晶粒碰裂相關性研究 = The Study of Correlation Between Die Cracking and Die Pick-up Candition in WLCSP Processing
by:
呂玉婷; 國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班
(Language materials, printed)
, [撰]
Subjects