戴維宏

Overview

Works:	1 works in 1 publications in 1 languages

Titles

大尺寸覆晶封裝翹曲評估 = Evaluation of Warpage for Flip Chip Super Large Package by: 國立高雄大學電機工程學系--電子構裝整合技術產業碩士專班; 戴維宏 (Language materials, printed) , [撰]

Subjects