江政憲

環氧樹脂對堆疊式封裝產品平面度最佳參數之研究 = The Study of Parameters of Epoxy Resin for the Optimization of the Warpage in Stacked Packaging Process by: 國立高雄大學電機工程學系--半導體製造智能化技術產業碩士專班; 江政憲 (Language materials, printed) , [撰]