蕭宏宇

Overview

Works:	1 works in 1 publications in 1 languages

Titles

薄覆晶封裝產品的環氧樹脂結合力應用之研究 = The Study of Adhesion Properties of Epoxy Molding Compound for Thin Flip Chip Bond Products by: 國立高雄大學電機工程學系--半導體製造智能化技術產業碩士專班; 蕭宏宇 (Language materials, printed) , [撰]

Subjects