熱固模料硬化過程的動力流變與介電分析 = Changes in diel...
謝達華

 

  • 熱固模料硬化過程的動力流變與介電分析 = Changes in dielectric properties of an epoxy-novolac molding compound during cure
  • Record Type: Language materials, printed : monographic
    Paralel Title: Changes in dielectric properties of an epoxy-novolac molding compound during cure
    Author: 謝達華,
    Place of Publication: 高雄市
    Published: 撰者;
    Year of Publication: 1991[民80]
    Description: [10], 88面圖,表格 : 29公分;
    Notes: 指導教授:蘇安仲
    Notes: 含參考書目
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  • 1 records • Pages 1 •
 
310001389462 博碩士論文區(二樓) 不外借資料 學位論文 008D/0009 541414 0434 1991 一般使用(Normal) On shelf 0
  • 1 records • Pages 1 •
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