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錫銀銅銲錫於不同迴銲條件下之高速衝擊試驗研究 = The Study o...

李淑華

錫銀銅銲錫於不同迴銲條件下之高速衝擊試驗研究 = The Study of High Speed Ball Impact Test of Lead-free SnAgCu Solder with Different Reflow Conditions

Record Type:	Language materials, printed : monographic
Paralel Title:	The Study of High Speed Ball Impact Test of Lead-free SnAgCu Solder with Different Reflow Conditions
Author:	李淑華,
Place of Publication:	[高雄市]
Published:	撰者;
Year of Publication:	2007[民96]
Description:	11, 73葉圖，表 : 30公分;
Subject:	衝擊試驗
Online resource:	http://handle.ncl.edu.tw/11296/ndltd/43286320012197198740
Notes:	指導教授：施明昌
Notes:	參考書目：葉68-73

錫銀銅銲錫於不同迴銲條件下之高速衝擊試驗研究 = The Study of High Speed Ball Impact Test of Lead-free SnAgCu Solder with Different Reflow Conditions
李, 淑華

錫銀銅銲錫於不同迴銲條件下之高速衝擊試驗研究 = The Study of High Speed Ball Impact Test of Lead-free SnAgCu Solder with Different Reflow Conditions / 李淑華撰 - [高雄市] : 撰者, 2007[民96]. - 11, 73葉 ; 圖，表 ; 30公分.
指導教授：施明昌參考書目：葉68-73.
衝擊試驗

錫銀銅銲錫於不同迴銲條件下之高速衝擊試驗研究 = The Study of High Speed Ball Impact Test of Lead-free SnAgCu Solder with Different Reflow Conditions
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