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封裝載板阻抗控制分析與研究 = Study of Substrate I...

凃政宏

封裝載板阻抗控制分析與研究 = Study of Substrate Impedance Control and Application

Record Type:	Language materials, printed : monographic
Paralel Title:	Study of Substrate Impedance Control and Application
Author:	凃政宏,
Secondary Intellectual Responsibility:	國立高雄大學
Place of Publication:	[高雄市]
Published:	撰者;
Year of Publication:	2008[民97]
Description:	81面圖，表 : 30公分;
Subject:	特性阻抗控制
Subject:	Impedance Control
Online resource:	http://handle.ncl.edu.tw/11296/ndltd/37871305269019376117
Notes:	指導教授：吳松茂
Notes:	參考書目：面68-70
Summary:	在高速訊號傳輸的設計中，阻抗的匹配與否關係到信號的質量優劣。阻抗匹配（Impedance matching），主要用於傳輸線上，以達到所有高頻的微波信號皆能傳至負載點的目的，不會有信號反射回來源點，進而提升能源效益。由於差動訊號傳輸比起單端訊號傳輸，會產生比較低的雜訊以及擁有比較高的共模雜訊抑制能力，非常適合用於高速訊號的傳輸架構。然而要設計一個好的差動傳輸線架構，除了做好傳輸線的設計外還必須考量到板廠的製程能力。本論文研究著重在藉由模擬、設計及量測封裝載板上的差動傳輸導線特性阻抗，來了解設計及實際載板間的差異，並探討線路成形尺寸、介質層及接地層三者對特性阻抗設計的影響，進而得到最佳的線路設計以達到特性阻抗控制的需求。 In the design with high-speed signal transmission, the matching of impedance would impact the quality of the signal. Impedance matching is primarily being implemented in the transmission line for the purpose of sending all the microwave signal of high-frequency to the destination without having signal reflection back to the source, thus enhancing the efficiency of power.Differential signaling is suitable for high speed signal transmission due to lower noise induction and higher common-mode noise rejection compared to its single-ended signaling counterpart. However, the process capability of substrate supplier must also be included in order to create a fine differential pair layout structure. The research of this thesis concentrates on the characteristic impedance of differential pair through simulation, design and real measurement, to understand the difference between design and actual substrate. Furthermore, it explores the effect of the formation of trace dimension, dielectric and ground to the design of characteristic impedance, resulting in optimal trace routing method to achieve the control of characteristic impedance.

封裝載板阻抗控制分析與研究 = Study of Substrate Impedance Control and Application
凃, 政宏

封裝載板阻抗控制分析與研究 = Study of Substrate Impedance Control and Application / 凃政宏撰 - [高雄市] : 撰者, 2008[民97]. - 81面 ; 圖，表 ; 30公分.
指導教授：吳松茂參考書目：面68-70.
特性阻抗控制Impedance Control

封裝載板阻抗控制分析與研究 = Study of Substrate Impedance Control and Application
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