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錫球合金成份對BGA封裝可靠度之研究 = Study of the Ef...

國立高雄大學電機工程學系碩士班

錫球合金成份對BGA封裝可靠度之研究 = Study of the Effect of the Composition of Solder Ball Alloy in Ball Grid Array Package

Record Type:	Language materials, printed : monographic
Paralel Title:	Study of the Effect of the Composition of Solder Ball Alloy in Ball Grid Array Package
Author:	王聰銘,
Secondary Intellectual Responsibility:	國立高雄大學
Place of Publication:	[高雄市]
Published:	撰者;
Year of Publication:	2009[民98]
Description:	12, 83面圖，表 : 30公分;
Subject:	球柵陣列封裝
Subject:	BGA
Online resource:	http://handle.ncl.edu.tw/11296/ndltd/73942627794766765929
Summary:	由於錫球在封裝中所扮演訊號傳遞的角色，而如何使錫球在消費者使用過程中，不論是在正常使用或者是受到外力衝擊的條件下，都能保持錫球完整性便是此研究的主要目標。本論文針對半導體封裝中錫球材料成份部份做一些探討，錫球在封裝製程中佔很重要的一個角色，錫球負責訊號的傳遞，只要錫球損壞，將會導致晶片無法輸入或輸出訊號而導致整個元件功能失效。本論文以封裝業界評估錫球可靠度的方式做一些深入的探討，進而比較出何種球成份合金組合、添加何種金屬元素，能有效提升錫球可靠度，延長使用時效，避免錫球掉落。 Since solder ball play an important role of signal interconnection in package, it is the major goal to maintain the strength and electric contact of the solder ball under standard liability testing. This thesis is focus on the study of the solder ball composition in ball grid array (BGA) package to evaluate solder ball reliability by various testing procedures. A set of maximum performance of the solder ball compositions which can improve the reliability, working life and minimize the failure modes of the solder ball has been achieved.

錫球合金成份對BGA封裝可靠度之研究 = Study of the Effect of the Composition of Solder Ball Alloy in Ball Grid Array Package
王, 聰銘

錫球合金成份對BGA封裝可靠度之研究 = Study of the Effect of the Composition of Solder Ball Alloy in Ball Grid Array Package / 王聰銘撰 - [高雄市] : 撰者, 2009[民98]. - 12, 83面 ; 圖，表 ; 30公分.
參考書目：面83.
球柵陣列封裝BGA

錫球合金成份對BGA封裝可靠度之研究 = Study of the Effect of the Composition of Solder Ball Alloy in Ball Grid Array Package
LDR:02456nam0a2200265 450 001 137196
005 20170214100902.0
009 137196
010 0 $b 精裝
100 $a 20170214y2009 k y0chiy09 e
101 1 $a chi $d chi $d eng
102 $a tw
105 $a ak m 000yy
200 1 $a 錫球合金成份對BGA封裝可靠度之研究 $d Study of the Effect of the Composition of Solder Ball Alloy in Ball Grid Array Package $z eng $f 王聰銘撰
210 $a [高雄市] $c 撰者 $d 2009[民98]
215 0 $a 12, 83面 $c 圖，表 $d 30公分
314 $a 指導教授：施明昌
320 $a 參考書目：面83
328 $a 碩士論文--國立高雄大學電機工程學系碩士班
330 $a 由於錫球在封裝中所扮演訊號傳遞的角色，而如何使錫球在消費者使用過程中，不論是在正常使用或者是受到外力衝擊的條件下，都能保持錫球完整性便是此研究的主要目標。本論文針對半導體封裝中錫球材料成份部份做一些探討，錫球在封裝製程中佔很重要的一個角色，錫球負責訊號的傳遞，只要錫球損壞，將會導致晶片無法輸入或輸出訊號而導致整個元件功能失效。本論文以封裝業界評估錫球可靠度的方式做一些深入的探討，進而比較出何種球成份合金組合、添加何種金屬元素，能有效提升錫球可靠度，延長使用時效，避免錫球掉落。 Since solder ball play an important role of signal interconnection in package, it is the major goal to maintain the strength and electric contact of the solder ball under standard liability testing. This thesis is focus on the study of the solder ball composition in ball grid array (BGA) package to evaluate solder ball reliability by various testing procedures. A set of maximum performance of the solder ball compositions which can improve the reliability, working life and minimize the failure modes of the solder ball has been achieved.
510 1 $a Study of the Effect of the Composition of Solder Ball Alloy in Ball Grid Array Package $z eng
610 0 $a 球柵陣列封裝 $a 錫球合金成份 $a 多重迴焊試驗 $a 錫球推力測試 $a 錫球拉力測試 $a 介金屬化合物
610 1 $a BGA $a Solder Ball Alloy $a Multi-reflow $a Ball Shear $a Ball Pull $a IMC Thickness
681 $a 008M/0019 $b 542201 1018 $v 2007年版
700 1 $a 王 $b 聰銘 $4 撰 $3 170858
712 0 2 $a 國立高雄大學 $b 電機工程學系碩士班 $3 166118
801 0 $a tw $b 國立高雄大學 $c 20090413 $g CCR
856 7 $z 電子資源 $2 http $u http://handle.ncl.edu.tw/11296/ndltd/73942627794766765929