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Modern solder technology for competi...
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Hwang, Jennie S.
Modern solder technology for competitive electronics manufacturing /
Record Type:
Language materials, printed : Monograph/item
Title/Author:
Modern solder technology for competitive electronics manufacturing /Jennie S. Hwang.
Author:
Hwang, Jennie S.
Published:
New York :McGraw-Hill,c1996.
Description:
xliv, 622 p. :ill. ;24 cm.
Series:
Electronic packaging and interconnection series
Subject:
Electronic packaging.
ISBN:
0070317496 :
Modern solder technology for competitive electronics manufacturing /
Hwang, Jennie S.
Modern solder technology for competitive electronics manufacturing /
Jennie S. Hwang. - New York :McGraw-Hill,c1996. - xliv, 622 p. :ill. ;24 cm. - Electronic packaging and interconnection series.
Includes bibliographical references and index.
ISBN: 0070317496 :NT$2,209
LCCN: 95044641 Subjects--Topical Terms:
182161
Electronic packaging.
LC Class. No.: TK7870.15 / H991 1996
Dewey Class. No.: 621.381/046
Modern solder technology for competitive electronics manufacturing /
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Modern solder technology for competitive electronics manufacturing /
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Jennie S. Hwang.
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New York :
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c1996.
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McGraw-Hill,
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xliv, 622 p. :
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ill. ;
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24 cm.
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Electronic packaging and interconnection series
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Includes bibliographical references and index.
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Electronic packaging.
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182161
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Solder and soldering.
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182496
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西方語文圖書區(四樓)
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320000044984
西方語文圖書區(四樓)
1圖書
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TK7870.15 H991 1996
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1 records • Pages 1 •
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